Advanced Flexible Component Placer
이형대응성을 강화한 1 GANTRY 6 SPINDLES HEAD의
범용기로써 최대 ㅁ 55mm IC부품대응이 가능하며
POLYGON 인식 알고리즘을 지원 복잡한 이형부품대응의
최적 솔루션을 제공합니다.
제/품/상/세/설/명
| 구 분 | SM482 | Alignment | Mega Flying Vision + Stage Vision | Placement Rate | Flying Vision | ㆍ1608 Chip : 28,000 CPH (Optimum)
ㆍSOP : 15,000 CPH (IPC9850)
ㆍQFP : 5,500 CPH (IPC9850) | |
Stage Vision | 1.4sec/QFP208P(Tray supply standard) | | Placement Accuracy | Chip
QFP | ±50㎛＠u+3∂/chip
±30㎛＠u+3∂/QFP | Short Distance Plasement | 0.1mm(0603)/0.15mm(1005) | |
Component Range
| Flying Vision | ㆍ0603 ~ □22mm chip
ㆍQFP,BGA(0.75Pitch)
ㆍ0402 CHIP(Option) | Stage Vision | ㆍ~ □55mm (up to vision size)
ㆍFOV35:~ □32mm IC(0.3P QFP, 0.5P BGA)
ㆍFOV45(Basic):~ □42mm IC(0.4P QFP, 1.0P BGA) | | Max Height | ㆍH 12mm (Flying vision)
ㆍH 15mm (Stage vision) | |
Feeder Slot | ㆍMax 120EA(8mm기준) ㆍMax 112EA(Docking Cart기준) | | Board Dimension (mm) | min PCB | 50(L)*40(W) | max PCB | ㆍ460(L)*400(W) : Standard
ㆍ510(L)*460(W) : Option
ㆍ610(L)*510(W) : Option ㆍ740(L)*460(W) : Option | PCB Thickness | 0.38~4.2mm | Weight | Approx.1,600 kg | | Utillity | Power | AC 200/220/380/415V (50/60Hz,3Phase) | Air consumption | 5~7Kg/㎡, 180Nl/min | External Dimension (mm) | 1650(L)*1680(W)*1530(H) |
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