항 목

 HP-520SPI

 HP-850SPI

 Accuracy & Repeatability

2.0 Cpk @ ±25㎛ (±0.015, 0.005)

 Cycle Time(PCB 200*200)

 Excluding Printing : 7 sec

*Real Time : approx. 13 sec

 Excluding Printing : 12 sec

*Real Time : approx. 18 sec 

 Stencil Frame Size

 std. 600*550(L*W)

        650*550, 736*736

 std. 800*800(L*W)

        1000*800, 1100*800

 PCB Size

 50*50mm - 520*420mm

 50*50mm - 850*450mm

 PCB Thickness

 0.4mm ~ 6mm

 PCB Warpage

0 ~ 8mm (Inc. Thickness)

 PCB Clamping

- Top link clamping (0.8 - 6t ) 

- Top knife edge clamping (0.2 - 0.8t ) 

- Vaccum Type (Option)

 PCB Under Clearance

 30mm

 Conveyor Width Control

 Automatic

 Squeegee Speed

 1 - 150mm/s(Inc. 0.01mm/s)

 Squeegee Pressure

Load-Cell 적용

 0.1-40kg/f (S/W)

 Load-Cell 적용

 0.1-60kg/f  (S/W)

 PCB Sepatation

-Distance : 0 - 5.0mm(Inc. 0.01mm)

-Speed : 1- 150mm/s (Inc.0.01mm/s) 

 Vision Camera

 Interlaced Scan CCD

F.O.V 11mm*8mm

 Fiducials

 Registered Figure Matching, Pattern Matching

 Fiducial Size

0.4mm ~ 5mm 

 Cleaning System

 IPA + PAPER +Vaccum Control을 S/W으로 사용

 Dimension(mm)

 2115(L)*1625(W)*1445(H)

 2550(L)*1915(W)*1445(H)

 Weight

 1,500Kg

1,800Kg 

 Power

AC 220V, 50/60HZ 3.0Kw 

 AC 220V, 50/60HZ 3.0Kw 

 Air

 0.5MPa, 400NL/min

 운영 Program

 산업용 PC/ MS WIindows /LCD Monitor

 Host Communication

 SEMEMA Interface(STD)